ChipSecure Adhesives

About Us

Leading Semiconductor Adhesive Specialists in Sion West

Pioneering advanced adhesive technologies for the semiconductor industry since 2015.

ChipSecure Adhesives stands as a premier manufacturer and supplier of specialized semiconductor-grade adhesives, headquartered in the vibrant industrial hub of Sion West, Mumbai. Our journey began with a singular vision — to bridge the gap between cutting-edge semiconductor innovation and reliable, high-performance bonding materials. Today, we serve over 200 clients across India, delivering adhesive solutions that power everything from consumer electronics to aerospace-grade microchips.

Our Sion West facility is equipped with state-of-the-art blending and quality-control laboratories, enabling us to formulate adhesives with precision down to the nanometer scale. We specialize in die attach adhesives, conductive silver pastes, underfill materials, and thermal interface compounds — each engineered to meet the exacting demands of modern semiconductor packaging. Our R&D team continuously collaborates with Mumbai's top research institutions to stay ahead of industry trends.

What truly sets us apart in the semiconductor adhesives space is our unwavering commitment to thermal stability, electrical conductivity, and long-term reliability. Every batch undergoes rigorous testing — including thermal cycling, shear strength analysis, and outgassing evaluation — before it reaches our clients. This obsession with quality has earned us ISO 9001:2015 certification and a reputation as one of Sion West's most trusted adhesive manufacturers.

Beyond our manufacturing excellence, we pride ourselves on being a true partner to our customers. Our technical support team, based right here in Sion West - Mumbai, provides on-site assistance, application engineering, and custom formulation services. Whether you're a startup prototyping a new chip design or an established fab scaling production, we work closely with you to develop the perfect adhesive solution for your specific application.

As we look toward the future, ChipSecure Adhesives remains dedicated to driving innovation in semiconductor materials. We're actively expanding our product portfolio to include UV-curable adhesives, silicone encapsulants, and wafer bonding compounds for advanced packaging technologies. Our mission is simple: to be the adhesive backbone of India's semiconductor revolution, one bond at a time.

350+ Projects Completed

200+ Happy Clients

10+ Years Experience

25+ Team Members

Products & Services

Our Semiconductor Adhesive Solutions

Comprehensive adhesive products engineered for every stage of semiconductor packaging, all manufactured in Sion West - Mumbai.

Die Attach Adhesives

Our premium die attach adhesives are formulated for high-reliability chip bonding applications, offering exceptional thermal conductivity and mechanical strength. Manufactured in our Sion West facility, these adhesives deliver consistent void-free bonding for power devices, LEDs, and advanced semiconductor packages.

With curing temperatures ranging from 120°C to 180°C and shear strengths exceeding 50 kg, our die attach adhesives are trusted by leading electronics manufacturers across Mumbai and beyond. Each batch is tested for thermal aging performance and ionic purity.

Learn More

Conductive Silver Paste

Our conductive silver paste delivers outstanding electrical conductivity with resistivity as low as 2×10⁻⁵ Ω·cm, making it ideal for die bonding, EMI shielding, and printed electronics. Formulated with ultra-fine silver particles, it provides smooth, uniform coverage for high-density interconnects.

Developed at our Sion West R&D lab, this silver paste offers excellent thixotropic properties for precise dispensing, screen printing, and jetting applications. It's widely used in the semiconductor industry for chip-on-board assembly and photovoltaic cell connection.

Learn More

Underfill Materials

ChipSecure's underfill materials provide superior protection for flip chip and BGA packages, reducing thermal stress and preventing solder joint fatigue. Our capillary flow underfills feature ultra-low viscosity and fast flow rates for reliable gap filling in high-density assemblies.

Engineered with low CTE and high Tg values, these underfills withstand thermal cycling from -55°C to 150°C without cracking or delamination. They're the go-to choice for semiconductor packaging houses in Sion West - Mumbai looking for long-term reliability in harsh environments.

Learn More

Thermal Interface Materials

Our thermal interface materials (TIMs) are designed to efficiently dissipate heat from high-power semiconductor devices, maintaining optimal junction temperatures. Available as thermal greases, pads, and gap fillers, they offer thermal conductivity from 2 to 8 W/m·K.

Manufactured in Sion West - Mumbai, these TIMs feature low thermal resistance and excellent conformability to irregular surfaces. They're ideal for power modules, LED lighting, and automotive electronics where thermal management is critical to performance and lifespan.

Learn More

UV Curable Adhesives

Our UV curable adhesives offer rapid curing in seconds under UV light, dramatically increasing production throughput. These optically clear adhesives provide excellent bond strength for glass, metal, and plastic substrates commonly used in optoelectronics and sensor packaging.

ChipSecure's UV adhesives are formulated with low shrinkage and minimal outgassing, making them suitable for precision optical alignment and camera module assembly. Our Sion West team can customize viscosity and cure depth for your specific process requirements.

Learn More

Silicone Encapsulants

Protect sensitive semiconductor components from moisture, dust, and mechanical shock with our premium silicone encapsulants. These flexible, optically clear or black encapsulants provide excellent electrical insulation and maintain their properties across extreme temperatures.

Our silicone encapsulants are particularly suited for automotive sensors, power supplies, and outdoor LED displays. They deliver superior adhesion to PCB substrates and eliminate stress on delicate wire bonds during thermal cycling, ensuring long service life.

Learn More

Solder Paste Adhesives

Our solder paste adhesives combine the bonding strength of adhesives with the electrical connectivity of solder, enabling reliable surface mount assembly. These no-clean formulations leave minimal residue and deliver excellent wetting on various pad finishes.

Available in leaded and lead-free compositions, our solder pastes are optimized for fine-pitch components and high-density PCB assembly. They're extensively used by EMS providers in Sion West - Mumbai for smartphones, IoT devices, and automotive electronics.

Learn More

Wafer Bonding Adhesives

Our wafer bonding adhesives are engineered for temporary and permanent bonding of silicon, glass, and compound semiconductor wafers. They provide uniform bond line thickness and exceptional thermal stability up to 300°C for advanced 3D packaging.

These adhesives support through-silicon via (TSV) processing and wafer thinning operations, ensuring clean debonding without residue. ChipSecure's Sion West manufacturing ensures consistent batch-to-batch quality for high-volume semiconductor fabs.

Learn More

Reworkable Adhesives

Our reworkable adhesives allow for easy component removal and replacement without damaging the substrate, reducing waste and rework costs. These thermally reversible adhesives maintain strong bonds during operation but release cleanly at elevated temperatures.

Ideal for prototyping and high-value component assembly, these adhesives are widely adopted by R&D labs and contract manufacturers in Sion West - Mumbai. They offer the perfect balance between bond integrity and repairability for complex semiconductor assemblies.

Learn More

Photo Gallery

Our Facility & Products

A visual tour of our Sion West - Mumbai manufacturing facility, laboratories, and semiconductor adhesive products.

Manufacturing Facility

Quality Control Lab

Blending Equipment

Packaging Line

R&D Laboratory

Die Attach Application

Thermal Testing

Silver Paste Dispensing

Wafer Bonding

Video Gallery

Watch Our Adhesive Technology

Explore our semiconductor adhesive manufacturing processes, product demonstrations, and industry insights from our Sion West facility.

Testimonials

What Our Clients Say

Trusted by semiconductor manufacturers, EMS providers, and electronics companies across Sion West - Mumbai and beyond.

★★★★★

"ChipSecure's die attach adhesives have completely transformed our production line in Sion West. The shear strength and thermal performance are unmatched, and their technical support team is always just a phone call away. We've reduced rejection rates by 40% since switching to their products."

Rajesh Sharma

Production Manager • Sion West, Mumbai

★★★★★

"As a contract manufacturer in the Mumbai region, we rely heavily on consistent adhesive quality. ChipSecure Adhesives delivers batch after batch with zero variation. Their underfill materials have been critical for our flip chip assemblies, providing excellent reliability in demanding automotive applications."

Priya Patel

Quality Director • Sion West

★★★★★

"We've been sourcing our thermal interface materials from ChipSecure for over five years. Their TIMs have exceptional thermal conductivity and reliability, crucial for our power module applications. The team in Sion West always goes above and beyond to support our new product development."

Anita Desai

R&D Head • Mumbai

★★★★★

"What impresses me most about ChipSecure is their custom formulation capabilities. We needed a specialized UV-curable adhesive for our sensor packaging, and their team in Sion West developed a custom solution within just two weeks. The performance has been outstanding, and our yield rates have improved significantly."

Sneha Kulkarni

VP Operations • Sion West

★★★★★

"ChipSecure Adhesives is our go-to partner for all semiconductor bonding needs. Their conductive silver paste is the best we've tested in terms of conductivity and printability. Being based in Sion West ourselves, it's incredibly convenient to work with a local supplier who understands our unique requirements."

Vikram Mehta

CEO • Sion West, Mumbai

★★★★★

"The wafer bonding adhesives from ChipSecure have been instrumental in our advanced packaging projects. The bond uniformity and thermal stability are exactly what we needed for 3D stacking. Their Sion West team provides exceptional technical consultation and responsive customer service that sets them apart."

Amit Joshi

Process Engineer • Mumbai

FAQ

Frequently Asked Questions

Answers to common questions about our semiconductor adhesive products and services.

We manufacture a comprehensive range of semiconductor adhesives at our Sion West - Mumbai facility, including die attach adhesives, conductive silver pastes, underfill materials, thermal interface materials, UV curable adhesives, silicone encapsulants, solder paste adhesives, wafer bonding adhesives, and reworkable adhesives. Each product is engineered to meet the exacting standards of the semiconductor industry.

Absolutely. Our R&D team in Sion West, Mumbai specializes in custom adhesive formulation. We work closely with you to understand your specific application requirements — including thermal properties, electrical conductivity, viscosity, curing profile, and substrate compatibility — and develop a tailored solution that meets your exact specifications. Typical customization timelines range from 2 to 6 weeks.

Most of our semiconductor adhesives have a shelf life of 6 to 12 months when stored under recommended conditions (typically -20°C to 25°C depending on the product). Each product datasheet specifies exact storage requirements and shelf life. We also provide cold-chain shipping for temperature-sensitive formulations to ensure product integrity during transit from our Sion West facility.

Yes, we pride ourselves on providing exceptional technical support. Our team of application engineers, based in Sion West - Mumbai, offers on-site assistance, process optimization, troubleshooting, and training. We also provide detailed technical datasheets, application notes, and can conduct joint development programs for complex semiconductor packaging challenges.

ChipSecure Adhesives is ISO 9001:2015 certified, demonstrating our commitment to quality management systems. Our products are also compliant with RoHS and REACH regulations. We maintain rigorous in-house quality control with 100% batch testing for critical parameters including viscosity, thermal conductivity, shear strength, and ionic purity at our Sion West laboratory.

Our minimum order quantity varies by product — typically starting from 500 grams for standard formulations and 1 kg for custom blends. Standard delivery lead times range from 3 to 7 working days for stocked products, while custom formulations may take 2 to 4 weeks. We offer expedited shipping options and local delivery across Sion West - Mumbai and the greater metropolitan area.

Precision Bonding for Next-Gen Semiconductors

Nano-Level Adhesion for Critical Applications

Underfill & Encapsulation Excellence

Leading Semiconductor Adhesive Specialists in Sion West